Via Pedestal Mount as an Awarded International Design Winner for 2017
The Chicago Athenaeum/Europe has selected Talkaphone’s Via Series Access Communication and Courtesy Pedestal (VIA-AC-PM) for 2017 international winner for the GOOD DESIGN® Award in the Environments Category.
The Good Design Award is the most prestigious Global Awards Program for Design Excellence and Design Innovation for quality design of the highest form, function, and aesthetics, a standard beyond ordinary consumer products and graphics. Each year, The Chicago Athenaeum presents the GOOD DESIGN® Awards Program for the most innovative and cutting-edge industrial, product, and graphic designs produced around the world.
Talkaphone Senior Design Engineer Khushroo Patel developed the VIA from a concept to production for the newest innovation in communication pedestals for access and emergency. The expanded VIA product line is to be announced and debuted at ISC Show in Las Vegas next month, the largest security trade show in the US.
The Via pedestal is constructed of a steel body with marine grade stainless steel front panels. The vandal-resistant coating is designed to resist extreme weather conditions and comes standard in a deep, high gloss black finish.
The Via Series Access Pedestal is part of a greater line of products to be debuted at ISC West in Las Vegas, April 11-13th 2018. The Via Series is one of the most recent products in line with Talkaphone’s commitment to durable, intelligible, and reliable communication.
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Lindsay Mathers, Marketing Coordinator
T: 773-539-1100 x230